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  • Parkson Chemical
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    Hotline:0796-8613275 / 0796-8613285
    General manager Shi:13358261368
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    vip@fjfushan.cn
  • Parkson Chemical
    address:
    No. 66 Litang Road, East District, Jinggangshan Economic and Technological Development Zone, Ji'an County, Ji'an City, Jiangxi Province
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Copyright © 2018 江西百盛精细化学品有限公司. All rights reserved. 赣ICP备18015209号-1

Website construction: China Enterprise Power  Fuzhou

0796-8613275 / 0796-8613285

No. 66 Litang Road, East District, Jinggangshan Economic and Technological Development Zone, Ji'an County, Ji'an City, Jiangxi Province

13358261368

Applications

Potting epoxy curing agent

Product name Type Color(Gardner) Amine value(mgKOH/g) Viscosity(cps,25℃) Acid value(mgKOH/g) Solid  lacquer  (%) AHEW Addition  (phr)/100g  resin Gel time (min@25℃,150g mixture) Film drying  time  (hrs@25℃) Description
BS8500 Amide <12 445±30 100-400 <3 98 ±2 90 50 135 12 Low viscosity with long pot life, excellent hardness and adhesion. It can be mixed with other epoxy curing agent for usage.
BS849G Modified cycloaiiphaic amine <3 400±20 200-500 ----- -----  80 40 15 1 Low viscosity, fast solidification, high distortion temperature (TG12oC), light color, good color and luster stability, and good hardness and strength of condensate.
BS644  Modified   cycloaiiphaic amine <3 275±15 300-500 ----- ----- 112 59 40 7 Used for the colorless and transparent electronic embedment. Excellent gloss and coloration perfect weather resistance and yellowing resistance.
BS848 Modified cycloaiiphaic amine <3 300±20 300-500 ----- ----- 95 50 40 4.5 High cost performance, light color, good acid and alkali resistance, high hardness. Paint can also be used for high-grade steel structure.
BS345S Modified   cycloaiiphaic amine <3 250±20 400-800 ----- ----- 100 53 40 2.5 Slow dry, moderate viscosity, curing toughness, heat release small.
BS8784 Modified   cycloaiiphaic amine <5 315±15 30-70 ----- ----- 86 46 120 12 Modified fatty amine, with long pot life, low viscosity, light color and excellent flexitbility and can be used for embedment of electronic components.