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Powder curing agent, can be used with solid or liquid resin, low heating temperature, low softening point, good compatibility, high hardness after heating and curing
When used with epoxy resin at room temperature, this curing agent provides a high glass transition temperature, good chemical resistance, and other good comprehensive properties.
Medium-viscosity polyamide adhesive with moderate pot life, excellent adhesion and bonding strength, good flexibility, and good salt spray resistance.
Amide-amine with high imidazoline content, long pot life, and low heat release. When used in high-solids coatings, it can be mixed with alicyclic curing agents.