Product Center

Products

+
  • 聚酰胺固化剂.png

BS853N

Can be cured on damp surfaces and at low temperatures, dries quickly, and has good adhesion, chemical resistance, and corrosion resistance.

Type

Polyamide adduct

Chroma

<12

Water content %

135±15

viscosity (cps,25℃)

400-1000

Solid content

51±1.5

AHEW

267

Hundred grams of resin (E-51) addition amount (phr)

136

Gelation Time

100

Film drying time

2

Keyword:

BS853N

Product Details

Previous

Next

Previous

BS850

Next

Product Consultation

Enter your contact information, and our sales team will contact you immediately to understand your needs.